II. Integration
Our approach to integrating NST into microsystems involves aqueous oxidation of suitably prepatterned Ti films. Prior work showed that NST formed is biocompatible albeit crack-filled and hence is unsuitable for microsystems applications. We found that by prepatterning Ti films to suitable dimensions, cracks in NST can be controlled and even eliminated, as demonstrated in Figure 1.
Fig. 1. SEM micrographs of integrated NST: a. Arrays of crack-free 5 um square; b. Crack-filled blanket NST; c. Single 10 um square NST pad; d. Edge of a pad after focus ion beam milling revealing through thickness porous structure.
II. Integration